Memory
SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The initiative is designed to speed up the adoption of HBM4 memory and solidify SK hynix's and TSMC's leading positions in high-bandwidth memory and advanced processor applications. The primary focus of SK hynix's and TSMC's initial efforts will be to enhance the performance of the HBM4 stack's base die, which (if we put it very simply) acts like an ultra-wide interface between memory devices and host processors. With HBM4, SK hynix plans to use one of TSMC's advanced logic process technologies to build base dies to pack additional features and I/O pins within the confines of existing...
G.Skill and V-Color Unveil Factory Overclocked ECC RDIMMs for Ryzen Threadripper 7000 [UPDATED]
UPDATE 11/24: Demu, our reader with sharp eyes, notified us that Gigabyte had published a list of overclockable RDIMMs with ECC and AMD EXPO profiles supported by its TRX50...
7 by Anton Shilov on 11/23/2023
SK hynix Ships LPDDR5T: 9600 MT/s Memory for Smartphones
SK hynix had started volume shipments of its LPDDR5T-9600 memory for high-end smartphones, the company announced this week. So far, the company's LPDDR6 'Turbo' memory with a 9600 MT/s...
17 by Anton Shilov on 11/14/2023
Micron Introduces 128 GB DDR5-8000 RDIMMs with Monolithic 32 Gb Die
The path to high-capacity RDIMMs for servers has primarily been through 3D stacking (3DS) of DRAM dies using Through-Silicon Vias (TSVs). However, this has presented significant challenges in packaging...
15 by Ganesh T S on 11/9/2023
Solidigm Lays Off Employees Due to Industry Downturn
The solid state storage industry has been in a well-documented slide for the better part of the last year now. With storage product demand from both the client and...
18 by Anton Shilov on 10/25/2023
Micron and SK hynix Ship LPDDR5-9600 Memory for Next-Gen Smartphones
Fast memory is crucial for the performance of high-end system-on-chips that are getting more sophisticated every year. When it comes to smartphones, the most obvious way to boost memory...
23 by Anton Shilov on 10/25/2023
Samsung Announces 'Shinebolt' HBM3E Memory: HBM Hits 36GB Stacks at 9.8 Gbps
Samsung’s annual Memory Tech Day is taking place in San Jose this morning, and as part of the event, the company is making a couple of notable memory technology...
10 by Ryan Smith on 10/20/2023
HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface
High-bandwidth memory has been around for about a decade, and throughout its its continued development it has steadily increased in speed, starting at a data transfer rate from 1...
11 by Anton Shilov on 10/12/2023
Micron to Ship HBM3E Memory to NVIDIA in Early 2024
Micron has reaffirmed plans to start shipments of its HBM3E memory in high volume in early 2024, while also revealing that NVIDIA is one of its primary customers for...
7 by Anton Shilov on 9/28/2023
Micron Samples 128 GB Modules Based on 32 Gb DDR5 ICs
Micron is sampling 128 GB DDR5 memory modules, the company said at its earnings call this week. The modules are based on the company's latest single die, non-stacked 32...
9 by Anton Shilov on 9/28/2023
Corsair's Dominator Titanium Memory Now Available, Unveils Plans for Beyond 8000 MT/s
Corsair has started sales of its Dominator Titanium memory modules that were formally introduced this May. The new modules bring together luxurious look, customizable design, and extreme data transfer...
1 by Anton Shilov on 9/26/2023
Modular LPDDR Memory Becomes A Reality: Samsung Introduces LPCAMM Memory Modules
Although Low Power DDR(LPDDR) memory has played a pivotal role in reducing PC laptop power usage, the drawback to the mobile-focused memory has always been its tight signaling and...
30 by Ryan Smith on 9/25/2023
Samsung Unveils Industry's First 32Gbit DDR5 Memory Die: 1TB Modules Incoming
Samsung early on Friday revealed the world's first 32 Gb DDR5 DRAM die. The new memory die is made on the company's 12 nm-class DRAM fabrication process and not...
6 by Anton Shilov on 9/1/2023
SK hynix Begins Sampling HBM3e, Volume Production Planned For H1 2024
SK hynix on Monday announced that it had completed initial development of its first HBM3E memory stacks, and has begun sampling the memory to a customer. The updated ("extended"...
4 by Anton Shilov on 8/21/2023
Samsung, MemVerge, and H3 Build 2TB CXL Memory Pool
Samsung, MemVerge, H3 Platform, and XConn have jointly unveiled their 2 TB Pooled CXL Memory System at the Flash Memory Summit. The device can be connected to up to...
4 by Anton Shilov on 8/14/2023
SK Hynix Launches 24GB LPDDR5X-8500 Stacks for Smartphones, PCs, and HPC
On Friday, SK Hynix said it had started mass production of 24 GB LPDDR5X memory stacks that can be used for ultra-high-end smartphones and PCs. The company's LPDDR5X-8500 devices...
10 by Anton Shilov on 8/11/2023
Memory Makers on Track to Double HBM Output in 2023
TrendForce projects a remarkable 105% increase in annual bit shipments of high-bandwidth memory (HBM) this year. This boost comes in response to soaring demands from AI and high-performance computing...
9 by Anton Shilov on 8/9/2023
SK Hynix Shows Off 321-Layer 3D TLC NAND Device
SK Hynix showcased its 321-layer TLC NAND memory at the Flash Memory Summit 2023. The South Korean company is the first NAND maker to publicly demonstrate 3D NAND with...
11 by Anton Shilov on 8/9/2023
Micron's CZ120 CXL Memory Expansion Modules Unveiled: 128GB and 256GB
This week, Micron announced the sample availability of its first CXL 2.0 memory expansion modules for servers that promise easy and cheap DRAM subsystem expansions. Modern server platforms from...
7 by Anton Shilov on 8/9/2023
TeamGroup Unveils JEDEC-Spec DDR5-6400 Memory Kits: Faster 1.1V DDR5 On The Way For Future CPUs
While DDR5 memory has been out and in use for a couple of years now, so far we haven't seen the memory reach its full potential – at least...
5 by Anton Shilov on 7/31/2023
Samsung Begins to Produce Third 3nm Chip Amid Massive Losses On DRAM & NAND
Samsung this week reported their financial results for the second quarter of 2023, closing the book on an especially bleak quarter of the year with a massive $3.4 billion...
14 by Anton Shilov on 7/28/2023
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