Samsung Foundry Unveils Updated Roadmap: BSPDN and 2nm Evolution Through 2027
Samsung this week has unveiled its latest process technologies roadmap at the company's Samsung Foundry Forum (SFF) U.S. The new plan covers the evolution of Samsung's 2nm-class production nodes...
10 by on 6/13/2024
Report: MediaTek Working on Arm-Based Processor for Windows PCs
As Qualcomm's exclusivity for Arm-powered processors for Windows PCs is reportedly coming to its end, other chipmakers are getting ready to offer their Arm-based system-on-chips for Windows computers. And...
8 by on 6/12/2024
ASMedia Preps USB4 v2 Controller and PHY
The USB Implementers Forum (USB-IF) introduced USB4 version 2.0 in fall 2022, and it expects systems and devices with the tech to emerge later this year and into next...
8 by on 6/12/2024
Qualcomm: Some Snapdragon X Elite Laptops Will Come with 5G Modems
One of Qualcomm's indisputable strengths are its 5G modems – something which even Apple has yet to successfully ween itself from. And while Qualcomm is not integrating a modem...
19 by on 6/11/2024
No, It Does Not Fly: Corsair Demos '9000D Airflow' PC Case with 24 Fans
Trade shows like Computex always bring out their fair share of oddities, and this year was no exception, with one of the highlights being a Corsair PC case with...
9 by on 6/11/2024
Cheaper PCIe 5.0 x4 SSDs Incoming: Silicon Power Demos Phison E31T-Based SSD
Although consumer SSDs based on Phison's PS5026-E26 controller have been on the market for almost a year and a half now, the class-leading drives still carry a distinct price...
6 by on 6/11/2024
SK hynix: GDDR7 Mass Production To Start in Q4'2024
Update 06/13: SK hynix has sent a note to AnandTech clarifying that the company "plans to start mass production of GDDR7 in the fourth quarter of this year when...
2 by on 6/11/2024
Micron's GDDR7 Chip Smiles for the Camera as Micron Aims to Seize Larger Share of HBM Market
UPDATE 6/12: Micron notified us that it expects its HBM market share to rise to mid-20% in the middle of calendar 2025, not in the middle of fiscal 2025. For...
15 by on 6/7/2024
XPG Demos "Nia" Handheld Gaming PC With Foveated Rendering, Swappable DRAM
With the rise of the handheld gaming PC market, we've seen PC vendors and their partners toy with a number of tricks and tweaks to improve improve framerates in...
10 by on 6/5/2024
G.Skill Demonstrates DDR5-10600 Memory Modules On Ryzen 8500G System
Ultra-high performance memory modules are a staple of of Computex, and it looks like this year G.Skill is showing off the highest performance dual-channel memory module kit to date...
7 by on 6/5/2024
Frore Demos Solid-State AirJet Cooler in Action: Significantly Improving Both Laptop and SSD Performance
In recent months, Frore Systems has been turning heads with their fanless solid-state air cooler technology. The AirJet, as it's come to be called, was previously shown off at...
5 by on 6/4/2024
The Qualcomm Computex 2024 Keynote Live Blog (10:30pm PT/05:30 UTC)
For our second keynote of the day for Computex, we have the 4th Musketeer of the great PC powers, Qualcomm. Slated to be the most PC-focused of the four...
13 by on 6/3/2024
TSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027
TSMC's 3D-stacked system-on-integrated chips (SoIC) advanced packaging technologies is set to evolve rapidly. In a presentation at the company's recent technology symposium, TSMC outlined a roadmap that will take...
1 by on 5/31/2024
TSMC: Performance and Yields of 2nm on Track, Mass Production To Start In 2025
In addition to revealing its roadmap and plans concerning its current leading-edge process technologies, TSMC also shared progress of its N2 node as part of its Symposiums 2024. The...
9 by on 5/30/2024
Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab
To say that the global foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by AI and HPC applications is unprecedented, and...
12 by on 5/24/2024
MSI Teases Z790 Project Zero Plus Motherboard With CAMM2 Memory Support
MSI on Thursday published the first image of a new desktop motherboard that supports the innovative DDR5 compression attached memory module (CAMM2). DDR5 CAMM2 modules are designed to improve...
10 by on 5/24/2024
TSMC's Roadmap at a Glance: N3X, N2P, A16 Coming in 2025/2026
As announced last week by TSMC, later this year the company is set to start high-volume manufacturing on its N3P fabrication process, and this will be the company's most...
47 by on 5/22/2024
TSMC Offers a Peek at 'Global Gigafab' Process Replication Program
At its European Technology Symposium last week TSMC revealed some of the details about its Global Gigafab Manufacturing program, the company's strategy to replicate its manufacturing processes across its...
11 by on 5/22/2024
TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026
Customer demand for AI and HPC processors is driving a much greater use of advanced packaging technologies, particularly TSMC's chip-on-wafer-on-substrate (CoWoS) services. As things stand, TSMC is just barely...
8 by on 5/21/2024
TSMC Outlines Path to EUV Success: More Tools, More Wafers, & Best Pellicles In Industry
Although TSMC can't claim to be the first fab to use extreme UV (EUV) lithography – that title goes to Samsung – they do get to claim to be...
20 by on 5/17/2024
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